noax 3-staged Active Thermal Management
Avoiding heat
Through the exclusive use of industrial-grade components in the mainboard development, the generation of heat is avoided in the first development phase. Compared to consumer parts, industrial components consume significantly less energy and accordingly generate less heat. At the same time, the parts are more resistant to extreme temperatures, which further increases the likelihood of a long service life.
The arrangement of the components in the housing – the space planning of the IPC components on the mainboard, so to speak – plays an important role in avoiding heat inside the device and is part of the noax industrial computer development process.
Spreading heat
Even if only industrial-grade components are used, the controlled conduction of heat flows is of the utmost importance. The second stage of noax thermal management ensures the targeted distribution of the heat by means of thermal flow simulations in the development phase.
With numerous stress and climate tests, hotspots are identified in the development phase and prevented by appropriate design. This guarantees a service life for years and decades with maximum computing power.
Dissipating heat
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